发明名称 |
Schaltungsteil, Herstellungsverfahren für Schaltungsteile, Halbleiterbauelement, und Oberflächenlaminatanordnung für ein Schaltungsteil |
摘要 |
A circuit member includes a frame substrate formed, by patterning a rolled copper plate or a rolled copper alloy plate, with a die pad portion for a semiconductor chip to be mounted thereon, and a lead portion for an electrical connection to the semiconductor chip, having rough surfaces formed as roughed surfaces on upsides and lateral wall sides of the die pad portion and the lead portion, and smooth surfaces formed on downsides of the die pad portion and the lead portion, and the die pad portion and the lead portion are buried in a sealing resin, having a downside of the lead portion exposed. |
申请公布号 |
DE112006001048(T5) |
申请公布日期 |
2008.04.30 |
申请号 |
DE20061101048T |
申请日期 |
2006.04.26 |
申请人 |
DAI NIPPON PRINTING CO. LTD. |
发明人 |
SHIMAZAKI, YO;SAITO, HIROYUKI;MASUDA, MASACHIKA;MATSUMURA, KENJI;FUKUCHI, MASARU;IKEZAWA, TAKAO |
分类号 |
H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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