| 摘要 |
A fusible alloy for a pressure relief device is provided to improve wettability of the fusible alloy when the fusible alloy is melted under a specific temperature condition. A fusible alloy for a pressure relief device comprises 29.0~33.0 weight% of Bi, 14.0~21.0 weight% of Sn, 2.0~5.0 weight% of In, and Pb, where Pb, Bi, Sn, and In exhibit low melting points and so a quaternary alloy of Pb-Bi-Sn-IN exhibits a lower melting point. If the components of the quaternary alloy deviate from the above composition, the melting point becomes lower than 100°C, so that the quaternary alloy is melted at the temperature below the critical temperature or gas discharge is restricted at a specific temperature, causing gas explosion.
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