发明名称 ETCHANT MANAGING DEVICE
摘要 <p>An etching managing device is provided to regularly maintain etching performance and to get rid of the amount of a used undiluted solution by automatically controlling an etching liquid with a nitric acid density and a phosphoric acid density and properly managing the liquid supply of an etching liquid process bath. An etching liquid process bath(1) stores an etching liquid including a phosphoric acid. Etching liquid circulating equipment(12) circulates the etching liquid stored in the etching liquid process bath. Etching process equipment transfers a substrate(6) including an aluminum layer etched by the etching liquid circulated by the etching liquid circulating equipment. An etching liquid sampling unit(34) samples the etching liquid. A diluting unit dilutes the etching liquid sampled by the etching liquid sampling unit. A conductivity meter(15) obtains a conductivity value related to a nitric acid density of the etching liquid by measuring the conductivity of the etching liquid diluted by the diluting unit. A replacement liquid supply unit supplies a replacement liquid to the etching liquid process bath according to the conductivity value obtained by the conductivity meter.</p>
申请公布号 KR20080037511(A) 申请公布日期 2008.04.30
申请号 KR20070084987 申请日期 2007.08.23
申请人 HIRAMA LABORATORIES CO., LTD. 发明人 NAKAGAWA TOSHIMOTO;SATO HISAKUNI
分类号 H01L21/3063;C23F1/08;C23F1/20;G01N9/36;G01N21/35;G01N21/3554;G01N21/3577;G01N21/359;G01N27/10 主分类号 H01L21/3063
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