发明名称 |
ETCHANT MANAGING DEVICE |
摘要 |
<p>An etching managing device is provided to regularly maintain etching performance and to get rid of the amount of a used undiluted solution by automatically controlling an etching liquid with a nitric acid density and a phosphoric acid density and properly managing the liquid supply of an etching liquid process bath. An etching liquid process bath(1) stores an etching liquid including a phosphoric acid. Etching liquid circulating equipment(12) circulates the etching liquid stored in the etching liquid process bath. Etching process equipment transfers a substrate(6) including an aluminum layer etched by the etching liquid circulated by the etching liquid circulating equipment. An etching liquid sampling unit(34) samples the etching liquid. A diluting unit dilutes the etching liquid sampled by the etching liquid sampling unit. A conductivity meter(15) obtains a conductivity value related to a nitric acid density of the etching liquid by measuring the conductivity of the etching liquid diluted by the diluting unit. A replacement liquid supply unit supplies a replacement liquid to the etching liquid process bath according to the conductivity value obtained by the conductivity meter.</p> |
申请公布号 |
KR20080037511(A) |
申请公布日期 |
2008.04.30 |
申请号 |
KR20070084987 |
申请日期 |
2007.08.23 |
申请人 |
HIRAMA LABORATORIES CO., LTD. |
发明人 |
NAKAGAWA TOSHIMOTO;SATO HISAKUNI |
分类号 |
H01L21/3063;C23F1/08;C23F1/20;G01N9/36;G01N21/35;G01N21/3554;G01N21/3577;G01N21/359;G01N27/10 |
主分类号 |
H01L21/3063 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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