METHOD FOR MANUFACTURING A WAFER LEVEL PACKAGE USING A SEALING LAYER FOR METAL LINE

摘要

A method for manufacturing a wafer level package using a sealing layer for metal line is provided to shorten a manufacturing time and to reduce a manufacturing cost by manufacturing a semiconductor package without using a raw material such as a substrate or a wire. A sealing layer(306) for metal line including a thermoplastic resin and a metal compound is formed on a surface of a wafer including a plurality of semiconductor chips(302). A via hole for exposing a pad of the semiconductor chip is formed by melting the sealing layer for metal line. A metal seed layer for metal line is formed by melting the sealing layer for wiring by using a laser. An electrode and circuit line layer(314) is formed on a surface of the sealing layer for metal line by using the metal seed layer. A solder ball(316) is attached on the electrode and circuit line layer.