| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame which can wire on a substrate directly under a position in which a die pad is disposed and in which a mold defect, such as being unfilled of a sealing resin, a void, etc. is hard to occur, processing molding of a lead is easy, and which can improve the flatness of an external terminal; and to provide a resin-sealed semiconductor device using the same, and a method for manufacturing the same. <P>SOLUTION: The resin-sealed semiconductor device with built-in heatsink plate having a high heatsink property is realized by providing a holder 5 for placing a semiconductor element 10 by upsetting a hanging lead 7 connected to a frame, and engaging the opening 6 of a heatsink member 2 for aiding a heatsink from the semiconductor element 10 with the hanging lead 7 for supporting the holder 5. Even if the substrate is mounted, the substrate wiring can be installed directly under the resin-sealed semiconductor device. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
