发明名称 Testing device for electronic testing of a sample and method for producing a device
摘要 <p>The semiconductor wafer testing system a terminal system (7) with electrical contacts (12) on the underside of a circuit board (10) with conductor wires. The contacts may be hemispherical with the contact surface (12c) at the bottom accurately machined flat. The contact layer (22) is deposited on a base contact layer (12a) connected to the conductors in the circuit board.</p>
申请公布号 EP1600782(B1) 申请公布日期 2008.04.23
申请号 EP20050001875 申请日期 2005.01.29
申请人 FEINMETALL GMBH 发明人 BOEHM, GUNTHER;HOLOCHER, MICHAEL
分类号 G01R1/073;G01R31/26;G01R1/06;G01R1/067;G01R3/00;H01L21/66 主分类号 G01R1/073
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