发明名称 |
Testing device for electronic testing of a sample and method for producing a device |
摘要 |
<p>The semiconductor wafer testing system a terminal system (7) with electrical contacts (12) on the underside of a circuit board (10) with conductor wires. The contacts may be hemispherical with the contact surface (12c) at the bottom accurately machined flat. The contact layer (22) is deposited on a base contact layer (12a) connected to the conductors in the circuit board.</p> |
申请公布号 |
EP1600782(B1) |
申请公布日期 |
2008.04.23 |
申请号 |
EP20050001875 |
申请日期 |
2005.01.29 |
申请人 |
FEINMETALL GMBH |
发明人 |
BOEHM, GUNTHER;HOLOCHER, MICHAEL |
分类号 |
G01R1/073;G01R31/26;G01R1/06;G01R1/067;G01R3/00;H01L21/66 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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