| 摘要 |
A Pb plate and a base board loading electronic components such as a signal processing circuit and a power supply circuit are disposed on a case side so as to decrease the weight and the thickness of a sensor section. Besides, the case has a mechanical strength enough to support the active matrix substrate without deformation. Further, a small-signal amplifier control substrate and a gate driver control circuit substrate are inserted inside the case through slits and electrically connected to the electronic components loaded on the base board.
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