发明名称 |
Cooling structure using rigid movable elements |
摘要 |
A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of rigid elements provide mechanical compliance. In another alternative, the structure further includes a conformable heat-conducting layer disposed over the electronic device, wherein a bottom end of the plurality of rigid elements is coupled to the conformable heat-conducting layer.
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申请公布号 |
US7362582(B2) |
申请公布日期 |
2008.04.22 |
申请号 |
US20050151905 |
申请日期 |
2005.06.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KARIDIS JOHN P.;SCHULTZ MARK D.;WEBB BUCKNELL C. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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