| 摘要 |
<p>A wafer (W) is supported on each inner table (52) of a table (13). After a band-like sheet (S) is paid out on to the upper surface side of the wafers (W), pressing force is applied to the sheet by a pressing roller (14). The adhesion sheet (S) is cut along wafer outer edges by a cutter blade (63) installed on the free end side of a robot (15). The robot (15) has a function of passing the cutter blade (63) to a suction arm (100) and conveying wafers (W) from a magazine (200) to the table (13) and a function of transferring wafers (W), to which the sheet has been applied, to a post process.</p> |
