| 摘要 |
A heat radiation apparatus for an LED(Light Emitting Diode) lighting lamp is provided to more effectively radiate heat by transmitting heat generated from an LED to a heat radiation cover through a heat pipe. A heat radiation structure of an LED lighting lamp includes an aluminum substrate(110), at least one heat pipe(120), and a heat radiation cover(130). The aluminum substrate mounts a plurality of LEDs(102). A lower end of the at least one heat pipe is mounted on the aluminum substrate to radiate heat generated from the plurality of LEDs. The heat radiation cover is coupled to the aluminum substrate. The heat pipe is mounted in a right opposite direction of the aluminum substrate mounting the plurality of LEDs. An upper end of the heat pipe is coupled to the heat radiation cover to transmit the heat generated from the LEDs to the heat radiation cover. |
