BAR TYPE LED PACKAGE AND METHOD FOR FABRICATINNG THE SAME

摘要

A bar-type LED(Light Emitting Diode) package and a method for manufacturing the same are provided to reduce the volume of an electronic equipment and to optimize optical transfer toward a lateral side of a light guide panel in a back lighting unit by directly mounting an LED chip on a bar-type PCB. A bar-type LED package includes a rectangular bar-type PCB(10), an LED chip(20) mounted on the PCB, an encapsulation member(40). The encapsulation member is formed to have an upper light emitting surface(442) which has a wide transverse direction and a narrow vertical direction. Transverse sides of the encapsulation member perpendicular to the upper light emitting surface are made of internal total reflective surfaces of planar types. Each of the transverse sides becomes coplanarized with the respective long-lateral sides of the PCB. The encapsulation member is comprised of a first encapsulation section(42) for surrounding the neighbors of the LED chip and a second encapsulation section(44) for surrounding an upper portion of the first encapsulation section. The first encapsulation section is made of a silicon material and the second encapsulation section is made of an epoxy material. The first encapsulation section and the second encapsulation section are cut together with the PCB to have coplanar cross-sections configuring the transverse sides of the encapsulation member.