MANUFACTURING METHOD OF HIGH TEMPERATURE SUPERCONDUCTOR THICK FILMS BY USING CU-FREE PRECURSORS ON NI SUBSTRATES

摘要

A manufacturing method of a high temperature superconductor thick film tape by using a Cu-free precursor on an Ni substrate is provided to reduce a cost by simplifying the method, not requiring a rolling mill, a drawing machine, or a large furnace, and using Ni in stead of silver. A manufacturing method of a high temperature superconductor thick film tape by using an Ni substrate includes the steps of: forming a Cu thin film on the Ni substrate; forming on an upper part of the Ni substrate, precursor powder formed by mixing Cu-free Bi2O3, SrCO3, and CaCO3 at a predetermined ratio; and annealing the Cu thin film and the precursor powder formed on the Ni substrate for 1 hour at a temperature of 800 to 870 degrees centigrade and forming a superconductor structure with a predetermined thickness.