| 摘要 |
A substrate processing method and a computer-readable storage medium storing a program are provided to improve accuracy of processing parameter adjustment by calculating a processing parameter value to which the latest adjustment value for processing the next wafer to be processed is reflected. A substrate processing apparatus which comprises a processing chamber for executing processing on a substrate to be processed based on a predetermined processing parameter, and a measurement chamber for measuring surface profiles before and after the processing on the substrate to be processed. A substrate processing method comprises the steps of: performing a preprocessing measurement process for measuring a surface profile before the processing on the substrate to be processed in the measurement chamber; performing the first calculation process executed before starting transfer of the substrate to be processed to the processing chamber, executing calculation of a processing parameter value for achieving an object surface profile from the surface profile measurement value before processing; performing a determining process for determining whether the calculated processing parameter value is within a predetermined allowable range; performing the second calculation process executed during the time between the starting of transfer of the substrate to be processed and ending before the substrate enters the processing chamber, if the processing parameter value is determined within the allowable range, recalculating an adjustment value based on a measurement value of surface profile measured after the processing of the substrate, and the processing parameter value before the processing(S250,S260); and carrying the substrate to be processed into the processing chamber and performing the processing based on the calculated processing parameter value obtained in the second calculation process(S270,S280).
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