| 摘要 |
PROBLEM TO BE SOLVED: To provide a sample preparation method capable of preparing a sample piece with a desired portion held under a favorable condition. SOLUTION: A transparent protecting glass 2 is bonded onto a semiconductor element 1 surface by an epoxy resin 3 (Fig.2(a)). The epoxy resin 3 is heated (130°C) while applying pressure from an upper side of the protecting glass 2 to cure the epoxy resin 3 (Fig.2(b)). The sample piece 5 having 0.1 mm of thickness, 2.5 mm of width and 0.5 mm of height is cut out using a dicing saw (Fig.2(c)). The cut-out sample piece 5 is bonded onto a sample holder of an ion beam sample preparation device. COPYRIGHT: (C)2008,JPO&INPIT
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