| 摘要 |
Provided is a semiconductor device including a bonding pad allowing a probe contact region and a bonding region to be clearly distinguished and thereby controlled. The semiconductor device includes the bonding pad and a slit via region provided to a lower layer of the bonding pad. The slit via region includes a first region on which a plurality of slit vias are disposed in parallel, and a second region including at least one slit via. The width of the slit via of the first region is smaller than that of the slit via of the second region.
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