Hermetisch dichtes Gehäuse für ein elektronisches Bauelement

摘要

An electric component package (200) having a base (206) and a lid (208), the base and lid defining a hermetically sealed cavity (204) therebetween for accommodating an electric component (202) . The base (206) includes at least one conductive via (210) extending therethrough, allowing control and/or input/output (I/O) ports associated with the electric component (202) to be coupled to the conducive vias (210) to pass signals between the sealed cavity (204) and the exterior of the package without passing through the junction between the base (206) and lid (208). The electric component package (200) can be produced at the wafer level using conventional silicon wafer integrated circuit manufacturing machinery prior to separating the wafer into a plurality of devices.