| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device that prevents occurrence of molded resin peel-off, mount blister, etc. with a simple structure. SOLUTION: The resin-sealed semiconductor device is structured such that a pin hole 14 is formed at the center of a square glass epoxy frame substrate 11, a semiconductor IC chip 12 is fixed at a position opposite to the pin hole 14 of this substrate 11, and the substrate 11 is covered by molded resin 13. COPYRIGHT: (C)2008,JPO&INPIT
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