| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for achieving the working of an extremely thin semiconductor wafer or materials by securing the satisfactory adhesion of a wafer or the like in dicing, and preventing a chip or component from being peeled from an adhesive tape, and preventing the generation of such a failure as chip in the case of peeling the chip or IC component or the like after dicing under such circumstances that critical significance to the adhesive force of the adhesive sheet for dicing changes according to the change of the dicing technology of the semiconductor wafer or the like. SOLUTION: An adhesive sheet for water jet laser dicing is configured by laminating an adhesive layer on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and the adhesive sheet has adhesive strength of at least 1.5 N/20 mm. COPYRIGHT: (C)2008,JPO&INPIT |
