| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-part type epoxy resin composition capable of improving connection reliability and repairability with good balance when impacted, by using a bonding method and a compound having a latent active group, while maintaining a balance between curability and storage stability even if an adhesive area is suppressed when used as an under-filling material for sealing between semiconductors and substrates. SOLUTION: An area to be filled with an adhesive is controlled to provide a hollow part, and a latent compound or polymer that generates hydroxyl group during heating is contained therein. COPYRIGHT: (C)2008,JPO&INPIT |
