MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR NON-CONTACT COMMUNICATION MEMBER, MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR INTERPOSER, AND RETAINING DEVICE FOR IC CHIP

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing device effectively and inexpensively manufacturing a non-contact communication member.

SOLUTION: The manufacturing device 40 takes an IC chip 16 out of a sheet 35 with a wafer which has a support sheet 37 and a diced wafer 36 retained on the support sheet, and manufactures the non-contact communication member 10 by arranging the IC chip on an antenna substrate 20. The manufacturing device has a first suction nozzle 82 for taking the IC chip 16 out of the sheet 35 with a wafer, and a second adsorption nozzle 92 for arranging the IC chip on the antenna substrate 20 by receiving the IC chip from the first suction nozzle 82. The second suction nozzle has a positioning member 95 for positioning the IC chip when receiving the IC chip.

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