| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate for mounting an electronic component which is excellent in the accuracy of the relative bonding position of first and second bases, in which the second base is hardly deformed, and whose quality can be improved at low cost. <P>SOLUTION: A multilayer ceramic substrate for mounting an electronic component 10 comprises a first base 11 comprising a plurality of ceramic substrates, and a second base 12 whose upper portion for mounting the electronic component projects from the upper surface of the first base 11 and which comprises one or a plurality of the ceramic substrates on the approximately central portion of the upper surface side of the first base. The multilayer ceramic substrate has a concavity 16 having a cut hole 13 and the upper surface of one or a plurality second ceramic substrates 15 having no cut hole at the central portion of a first ceramic substrate 14 which comprises at least one layer at the upper surface side of the first base 11. The multilayer ceramic substrate has the second base 12 whose thickness is thicker than that of the first ceramic substrate 14 in such a manner that the upper portion of the second base projects from the upper surface of the cut portion 13 of the concavity 16 and the bottom surface of the second base is bonded to the bottom of the concavity 16. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
