| 摘要 |
PROBLEM TO BE SOLVED: To provide an internal peripheral blade cutting machine for single crystal ingots, and a cutting method using this which suppresses the deposition of a sludge and improves the life of an internal peripheral blade by reducing the frequency of dressing. SOLUTION: The internal peripheral blade cutting machine of this invention comprises an internal peripheral blade 2 rotatable at a high speed to cut a silicon single crystal ingot 1. This internal peripheral blade 2 is electrodeposited with a diamond grain layer on the inner periphery of a metal base made of a doughnut shape stainless steel sheet. Further, it has a supply side cutting liquid supply nozzle 3 and a cleaning side cutting liquid supply nozzle 4 as cutting liquid supply nozzles. Further, it is characterized to have as the cutting liquid, the function of supplying water having a specific resistance of 1 MΩcm or more. COPYRIGHT: (C)2008,JPO&INPIT |
