| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining body which can keep excellent mechanical strength even under high temperature conditions using joining material having no lead substantially, and further to provide a semiconductor device. SOLUTION: Instead of an expensive Au-Sn eutectic alloy substantially containing 80 mass% of Au, an Au-Sn alloy containing Au less than that of the Au-Sn eutectic alloy by 40 to 60% can be applied for high temperature soldering by introducing a quenching process in a mounting process. The melting point of a low-Au-containing alloy produced at an ordinary cooling speed is disturbed by a non-equilibrium peritectic reaction, and becomes lower than the melting point on the equilibrium diagram. In this case, when the Au-Sn alloy is produced by quenching, the amount of the phase to be produced at the melting point on the equilibrium diagram or at its temperature increases, and the heat resisting property can be improved. COPYRIGHT: (C)2008,JPO&INPIT |
