发明名称 SOLID-STATE IMAGE SENSING DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus reducing a leakage current among pixel cells, achieving a separation among the pixel cells proper to fining and improving the sensibility of an optoelectric transducer and a method for manufacturing the solid-state imaging apparatus. <P>SOLUTION: The solid-state imaging apparatus by one mode has a plurality of the pixel cells containing second conductivity type charge storage layers formed in second conductivity type semiconductor layers formed to the upper section of a first conductivity type substrate wafer. The solid-state imaging apparatus further has first conductivity type element isolation diffusion layers which are formed around the pixel cells to electrically isolate each pixel cell, and partially have different impurity concentrations in a plane. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008084962(A) 申请公布日期 2008.04.10
申请号 JP20060261023 申请日期 2006.09.26
申请人 TOSHIBA CORP 发明人 IHARA HISANORI
分类号 H01L27/146;H01L21/761;H01L31/10 主分类号 H01L27/146
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