| 摘要 |
PROBLEM TO BE SOLVED: To provide a package that allows solder to have a high fluidity when a substrate and a lid body of an electronic apparatus are solder-bonded using a solder that does not contain lead thereby to achieve an electronic apparatus that is highly reliable in temperature cycling, and that is capable of holding hermeticity of the electronic apparatus even if heat history of 250 to 260°C is added when the electronic apparatus is mounted on an external electric circuit board, and to provide an electronic apparatus. SOLUTION: The bond structure comprises: a base board 1; a metal layer 2 that contains Ni and Co and is formed on the surface of the base board 1; a first solder layer 3a that has a first melting point and is formed on the surface of the metal layer 2; and a second solder layer 3b that has a second melting point higher than the first melting point and is formed on the first solder layer 3a. COPYRIGHT: (C)2008,JPO&INPIT |
