发明名称 LASER PROCESSING METHOD
摘要 A laser processing method in which a light collection lens (108) is moved along a line (50) including a planned cut line (5) and, when the lens (108) is located above a processing region (30) having an outer shape between a workpiece (1) and a frame (22), laser light (L2) for measurement is collected by the lens (108) and reflected light of the laser light (L2) reflected by the surface (3) of the workpiece (1) is detected. Based on this detection, while the distance between the surface (3) and the lens (108) is adjusted to be substantially constant so that a light collection point (P) of laser light (L1) for processing is at a position a specific distance away from the surface (3), the laser light (L1) is collected by the lens (108) to form melted region (13) inside the workpiece (1).
申请公布号 WO2008041604(A1) 申请公布日期 2008.04.10
申请号 WO2007JP68820 申请日期 2007.09.27
申请人 HAMAMATSU PHOTONICS K.K.;KUNO, KOJI;SUZUKI, TATSUYA;ATSUMI, KAZUHIRO 发明人 KUNO, KOJI;SUZUKI, TATSUYA;ATSUMI, KAZUHIRO
分类号 B23K26/38;B23K26/06;B23K26/40;H01L21/301 主分类号 B23K26/38
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