| 摘要 |
A selective soldering apparatus comprises a bath (3) for molten solder (5), a solder nozzle (19) and a pump (9) for pumping molten solder (5) through the nozzle (19). The nozzle has a nozzle body (21) with an inner bore (22) through which solder is pumped to overflow a nozzle outlet (33). A jacket (23) provided around the nozzle body (21) to form an enclosed space (26) open at its upper end (28) to solder which has overflowed from the nozzle outlet (33) and the cover lower end being adjacent the surface (11) of molten solder in the bath, wherein a spiral pathway (25) is provided in the enclosed space (26) so that the overflowed solder runs down the pathway into the solder bath (3). A port (39) is provided at the lower end of the jacket for gas to flow into or out of the spiral pathway so that the pathway can be purged of air when solder is not flowing through the pathway. |
