| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency transmission conversion circuit which can be easily manufactured and does not exert influence on transmission characteristics. SOLUTION: The high frequency transmission conversion circuit comprises a dielectric substrate 10, a ground part 13 of a microstrip line formed on the bottom of the dielectric substrate 10, a signal line part 11 of the microstrip line formed on the plane of the dielectric substrate, and ground electrodes 12a, 12b of a coplanar line formed on both the sides of a part of the signal line part 11, wherein the ground electrodes 12a, 12b of the coplanar line and the ground part 13 of the microstrip line are connected to each other by electromagnetic coupling and/or capacity coupling to ground a high frequency signal. COPYRIGHT: (C)2008,JPO&INPIT
|
