| 摘要 |
A semiconductor device includes a semiconductor element and peripheral circuit portions such as a matching circuit portion, a bias circuit portion, and a capacitor element which are mounted on and connected to a substrate. The semiconductor device can ground the semiconductor element to improve the heat radiation property of the semiconductor element without providing any via hole in the semiconductor substrate. The semiconductor device comprises a semiconductor element (2) mounted on a substrate (1), peripheral circuit portions (30, 40) mounted on the substrate (1) and connected to the semiconductor element (2), an electrode (30e) provided in the peripheral circuit portion (30) and grounded, a metal layer (30m), a grounding electrode (30s) connected to the metal layer (30m) and a source electrode (2s) of the semiconductor element (2), and an electrode (30d) connected to a gate electrode (2g) of the semiconductor element (2). |
