摘要 |
<p>Provided is a vapor-deposition apparatus capable of feeding the vapor of a filming material generated in a vapor generating unit, without any temperature drop to a vapor-deposition head. The vapor-deposition apparatus (13) subjects a treatment object (G) to a filming treatment by a vapor deposition. In this vapor-deposition apparatus (13), a treatment chamber (30) for filming the treatment object (G) and a vapor generating chamber (31) for evaporating the filming material are arranged adjacent to each other. The apparatus is equipped with exhausting mechanisms (36 and 41) for evacuating the inside of the treatment chamber (30) and the inside of the vapor generating chamber (31). In the treating chamber (30), there is arranged a steam injecting port (80) for injecting the vapor of the filming material. In the vapor generating chamber (31), there are arranged vapor generating units (70 to 72) for evaporating the filming material, and control valves (75 - 77) for controlling the feed of the vapor of the filming material. Further arranged are passages (81 - 83 and 85) for feeding the vapor of the filming material generated in the vapor generating chamber (31), not to the outsides of the treating chamber (30) and the vacuum generating chamber (31) but to the steam injecting port (80).</p> |
申请人 |
TOKYO ELECTRON LIMITED;WATANABE, SHINGO;ONO, YUJI;HASEGAWA, KOYU;OGAWA, MASAHIRO;HONDA, KOUICHI |
发明人 |
WATANABE, SHINGO;ONO, YUJI;HASEGAWA, KOYU;OGAWA, MASAHIRO;HONDA, KOUICHI |