Semiconductor device and method for manufacturing the same

摘要

A semiconductor device 100 includes a first semiconductor chip 101; a multilayer wiring 200 which is formed on the first semiconductor chip and which is connected to the first semiconductor chip; a second semiconductor chip 201 connected to the first semiconductor chip by way of the multilayer wiring; a sealing material 115 which seals the second semiconductor chip; and projecting plugs 112 which are connected to the multilayer wiring and whose extremities become exposed on the sealing material.