发明名称 SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD USING THE SAME
摘要 A chemical mechanical polishing slurry composition is provided to realize a high polishing rate and improved polishing selectivity even at a low concentration, and to reduce erosion and dicing. A chemical mechanical polishing slurry composition comprises a solid solution containing at least one rare earth metal or rare earth metal oxide selected from Y2O3, Y, Gd and Gd2O3 incorporated into the matrix of polishing particles with a uniform distribution. The matrix comprises at least one selected from the group consisting of Si, SiO2, Al, Al2O3, Ce, CeO2, Ti, TiO2, Zr and ZrO2. The solid solution is used in an amount of 0.01-30 wt% based on the total weight of the slurry composition.
申请公布号 KR100819769(B1) 申请公布日期 2008.04.08
申请号 KR20060138193 申请日期 2006.12.29
申请人 CHEIL INDUSTRIES INC. 发明人 LIM, GEON JA;LEE, IN KYUNG;KANG, DONG HUN;KIM, WON LAE;CHOI, WON YOUNG
分类号 C09K3/14 主分类号 C09K3/14
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