AUTOMATIC MOVING DEVICE FOR WELDING INSIDE DIAMETER OF SEMICONDUCTING BELLOWS

摘要

An automatic moving device for welding an inside diameter of a bellows for a semiconductor is provided to automatically weld an inside diameter part of a thin plate and to extract and discharge the welded thin plate stably by automatically transferring the thin plate to a press having a welding machine. A thin plate and a dividing plate are inserted into a cylindrical loader(10). A first finger assembly(20) is located on an upper portion of the cylindrical loader. The first finger assembly moves up and down to extract the thin plate. A first module(30) guides a reciprocating motion of the first finger assembly. A press(40) compresses the thin plate extracted by the first finger assembly and welds the compressed thin plates. A second finger assembly(60) extracts the welded thin plate. A second module(70) guides a reciprocating motion of the second finger assembly. The first finger assembly includes a first finger(201). The first finger divides the thin plate in the cylindrical loader from the dividing plate to extract it.