发明名称 |
Printed conductive connectors |
摘要 |
Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.
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申请公布号 |
US7354794(B2) |
申请公布日期 |
2008.04.08 |
申请号 |
US20050062019 |
申请日期 |
2005.02.18 |
申请人 |
LEXMARK INTERNATIONAL, INC. |
发明人 |
ANDERSON FRANK E.;CORLEY, JR. RICHARD E.;SPIVEY PAUL T.;SULLIVAN CARL E. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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