发明名称 HOUSING FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To achieve a housing for electronic component exhibiting good electromagnetic shielding performance and capable of preventing corrosion due to contact of different kinds of metal. SOLUTION: Since a base mount 12 and a cover 13 are bonded by a shield adhesive layer 15 composed of a material produced by adding and dispersing filler having high permittivity to an adhesive material such as a polymer material exhibiting adhesion, the base mount 12 and the cover 13 can be insulated in DC and connected (short-circuited) in high frequency. Consequently, a contact potential generated through contact of different kinds of metal does not cause a DC current to flow between the base mount 12 and the cover 13, thus eliminating the risk of galvanic corrosion. Since the impedance between the base mount 12 and the cover 13 is low for an electromagnetic wave, the electromagnetic wave can be released as a noise current to a GND circuit 23 and an electronic component 21 can be shielded electromagnetically from the outside of the housing 11. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078313(A) 申请公布日期 2008.04.03
申请号 JP20060254657 申请日期 2006.09.20
申请人 DENSO CORP 发明人 IWAMIYA HIROKI
分类号 H05K9/00 主分类号 H05K9/00
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