发明名称 REWORKABLE PASSIVE ELEMENT EMBEDDED PRINTED CIRCUIT BOARD
摘要 A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.
申请公布号 US2008079118(A1) 申请公布日期 2008.04.03
申请号 US20070862521 申请日期 2007.09.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BANG HYO-JAE;LEE DONG-CHUN;HAN SEONG-CHAN;LEE JUN-YOUNG;KIM JUNG-HYEON
分类号 H01L29/00;H05K3/30 主分类号 H01L29/00
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