发明名称 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment method capable of cleanly treating substrates by organic compound gas, a manufacturing method for a semiconductor device using the substrate treatment method, a substrate treatment apparatus capable of cleanly treating the substrates by the organic compound gas, and a recording medium storing a program for operating the substrate treatment apparatus. SOLUTION: The substrate treatment method comprises a first process for setting the temperature of a substrate to be treated on which an metallic layer is formed to a first temperature and forming a metal complex by making the metallic layer absorb treatment gas containing organic compounds, and a second process for heating the substrate to be treated to a second temperature higher than the first temperature and sublimating the metal complex. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078618(A) 申请公布日期 2008.04.03
申请号 JP20070149614 申请日期 2007.06.05
申请人 FUJITSU LTD;TOKYO ELECTRON LTD;EBARA CORP 发明人 MIYOSHI SHUSUKE;ISHIKAWA KENJI;TATEISHI HIDEKI;HAYASHI MASAKAZU;NISHIKAWA NOBUYUKI
分类号 H01L21/3205;H01L21/027;H01L21/304;H01L21/3065;H01L21/3213;H01L23/52 主分类号 H01L21/3205
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