发明名称 |
APPARATUS AND METHOD FOR PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment method capable of cleanly treating substrates by organic compound gas, a manufacturing method for a semiconductor device using the substrate treatment method, a substrate treatment apparatus capable of cleanly treating the substrates by the organic compound gas, and a recording medium storing a program for operating the substrate treatment apparatus. SOLUTION: The substrate treatment method comprises a first process for setting the temperature of a substrate to be treated on which an metallic layer is formed to a first temperature and forming a metal complex by making the metallic layer absorb treatment gas containing organic compounds, and a second process for heating the substrate to be treated to a second temperature higher than the first temperature and sublimating the metal complex. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008078618(A) |
申请公布日期 |
2008.04.03 |
申请号 |
JP20070149614 |
申请日期 |
2007.06.05 |
申请人 |
FUJITSU LTD;TOKYO ELECTRON LTD;EBARA CORP |
发明人 |
MIYOSHI SHUSUKE;ISHIKAWA KENJI;TATEISHI HIDEKI;HAYASHI MASAKAZU;NISHIKAWA NOBUYUKI |
分类号 |
H01L21/3205;H01L21/027;H01L21/304;H01L21/3065;H01L21/3213;H01L23/52 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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