FORMATION METHOD OF CIRCUIT MATERIAL AND CIRCUIT MATERIAL FORMED BY METHOD

摘要

PROBLEM TO BE SOLVED: To provide a formation method of a circuit material which is excellent in workability and enables a bus bar to be readily and surely stuck to a portion of a copper foil pattern of a printed substrate, requiring increase of an allowable current amount and furthermore does not require special resist treatment for the bus bar. SOLUTION: A bus bur to be stuck to at least a part of a surface of a copper foil pattern of a printed substrate is provided; the width of the bus bar is made smaller than that of the copper foil to be stuck; an insulating sheet slightly larger than the bus bar is stuck to one surface of the bus bar in advance; the other surface exposing the bus bar is disposed in lamination in the surface of the copper foil pattern; an outer circumferential part projecting from the bus bar of the insulating sheet is fixed to the surface of the printed substrate and the bus bar is fixed to the surface of the copper foil pattern. COPYRIGHT: (C)2008,JPO&INPIT