| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer polishing method and a semiconductor wafer polishing apparatus that can surely detect the polishing end point. <P>SOLUTION: A spindle 6 holds a semiconductor wafer W on which a pattern 50 having a periodicity is formed at the polishing end point of a layer to be polished, and a rotating table 2 is provided with a polishing pad 4 on a surface thereof. A polishing method polishes the semiconductor wafer W by bringing the layer to be polished into contact with the polishing pad 4 while rotating the spindle 6 and the rotating table 2 respectively. The periodicity of the pattern 50 is determined so as to produce resonance by adding oscillations that occur when the pattern 50 reaches the polishing pad 4 to oscillations that occur when the spindle 6 and the rotating table 2 are rotating. <P>COPYRIGHT: (C)2008,JPO&INPIT |
