发明名称 THERMOSETTING SILICONE COMPOSITION AND LIGHT EMISSION DIODE ELEMENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting silicone composition excellent in transparency, presenting cured products having little time-dependent discoloration and suitable for a protection material for light emission diodes, a lens material and the like. <P>SOLUTION: The thermosetting silicone composition comprises (A) an organopolysiloxane having at least one structure expressed by general formula [wherein m expresses 0, 1 or 2 integer; R<SP>1</SP>expresses H, phenyl or a halogenated phenyl; R<SP>2</SP>expresses H or methyl; R<SP>3</SP>expresses a monovalent 1-10C organic residue; Z<SP>1</SP>expresses a divalent residue represented by -R<SP>4</SP>-, -R<SP>4</SP>O- or -R<SP>4</SP>(CH<SB>3</SB>)<SB>2</SB>SiO-(R<SP>4</SP>expresses a 1-10C organic group); Z<SP>2</SP>expresses O or a divalent 1-10C organic residue] in the molecule and (B) an organic peroxide in an effective amount as a curing catalyst. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008074982(A) 申请公布日期 2008.04.03
申请号 JP20060256581 申请日期 2006.09.22
申请人 SHIN ETSU CHEM CO LTD 发明人 KOZAI TOSHIYUKI
分类号 C08F299/08;C08G77/50;C08L83/07;H01L33/56;H01L33/58 主分类号 C08F299/08
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