| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus capable of positively ensuring a heat transfer action to a heat radiating plate without allowing bubbles to remain when the heat radiating plate is integrally joined to the bottom surface of a surface-mounting type light-emitting diode via binder. <P>SOLUTION: The apparatus is provided with the surface-mounting type light-emitting diode 1 having a light-emitting diode chip 12 provided in a package 11, a wiring substrate 2 having the light-emitting diode 1 mounted thereon, and the heat radiating plate 3 integrally joined to the back surface of the wiring substrate 2. A convex portion 31 is formed on the surface of the wiring substrate 2 side of the heat radiating plate 3, and an insertion hole 23 having a diameter larger than that of the outside shape of the convex portion 31 is formed on the wiring substrate 2. The convex portion 31 is integrally joined via a solder 6 to the bottom surface of the package 11 through the insertion hole 23. <P>COPYRIGHT: (C)2008,JPO&INPIT |
