发明名称 Semiconductor device having buried gate line and method of fabricating the same
摘要 A semiconductor device having a buried gate line with a shaped gate trench and a method of fabricating the same are disclosed. The semiconductor device includes a trench isolation layer provided in a semiconductor substrate to define a multi-surfaced active region/channel. A gate line extending to the trench isolation layer fills a portion of the gate trench. The gate trench is formed with a series of depressions to accommodate peaks in the channel. The combination of depressions/peaks operate to increase the effective area of the channel, thereby enabling smaller channel semiconductor devices to be formed without increasing the width thereof.
申请公布号 US2008079070(A1) 申请公布日期 2008.04.03
申请号 US20070797137 申请日期 2007.05.01
申请人 SEO HYEOUNG-WON;SON YOUNG-WOONG;LEE KANG-YOON;KIM BONG-SOO 发明人 SEO HYEOUNG-WON;SON YOUNG-WOONG;LEE KANG-YOON;KIM BONG-SOO
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
代理机构 代理人
主权项
地址