| 摘要 |
A microelectronic die includes: a die substrate; an integrated circuit supported in an active area of the substrate; a plurality of bond pads disposed at a surface of the substrate, at least some of the bond pads being coupled to the integrated circuit; a guard wall supported in the substrate and surrounding a periphery of the active region; and electrical connections adapted to apply a voltage differential across the guard wall to allow a damage testing of the guard wall. |
