Chip comprises contact element for electrical contact of chip, where contact element is covered with organic layer

摘要

The chip comprises a contact element for electrical contact of the chip (1), where the contact element is covered with an organic layer. The contact element has a contact surface (2) for a wire connection and is made of copper or a substance which is based on copper. The organic layer contains imidazole or its derivative and a nitrogen heterocycles or its derivatives. Independent claims are also included for the following: (1) an arrangement comprising chip (2) a semi conductor wafer (3) a method for manufacturing semiconductor wafer (4) a method for manufacturing chip (5) a method for contacting chip.