| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming a cured film having such development property that it can be used for a photolithography process, and being excellent also in adhesion, heat resistance, and transparency. <P>SOLUTION: The photosensitive resin composition comprises a polymer component (A) and a photopolymerizable monomer (B), wherein the polymer component (A) constitutes a polymer comprising monomer components essentially including a compound (a-1) represented by formula (1), wherein X and Y each independently represent H or a linear or optionally branched 1-4C hydrocarbon group; R1 and R2 are each independently H, a 1-20C hydrocarbon group which may have a substituent or a carboxyl group; and a cyclic structure connecting R1 and R2 may be formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
