发明名称 LIGHT-EMITTING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus capable of reliability over a long time by relaxing an applied stress due to a thermal stress on a portion of soldering and effectively preventing occurrence of a crack of a solder filet. <P>SOLUTION: The apparatus is provided with a light-emitting diode 1 having an LED chip 12 provided in a package 11, and a wiring board 2 having the light-emitting diode 1 electrically connected thereto. The light-emitting diode 1 has a lead terminal 13 connected to a wiring pattern 22 formed on the wiring board 2, and the lead terminal 13 is formed as a stress absorbing portion 13a having a bent middle portion and spring performance. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078585(A) 申请公布日期 2008.04.03
申请号 JP20060259384 申请日期 2006.09.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 WADA DAISUKE;FUJIWARA KOKI;KUZUHARA KAZUNARI;TAKAMI SHIGENARI
分类号 H01L33/64 主分类号 H01L33/64
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