| 摘要 |
PROBLEM TO BE SOLVED: To provide a connecting device capable of restraining occurrence of an intermetallic compound at the time when a protruded electrode containing tin is pressure-contacted at an elastic arm, in the connecting device in contact with the protruded electrode of an electronic component such as an IC package. SOLUTION: A connecting part formed by sheet metal working or a plating process has a spiral-shaped elastic arm 22. The elastic arm 22 has a coating layer 33 formed on the surface of a core part 30 equipped with a conductive layer 31 and an elastic layer 32, and the coating layer 33 is formed of a platinum-family metal layer, preferably, of plated palladium. When the protruded electrode 42 containing tin provided at the electronic component comes in contact with the coating layer 33, metal diffusion is hardly generated at the contact part, and an intermetallic compound is restrained from being generated and deposited on the contact part. COPYRIGHT: (C)2008,JPO&INPIT
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