| 摘要 |
PROBLEM TO BE SOLVED: To allow easy connection of other semiconductor devices, active components, or passive components in a semiconductor device of WL-CSP. SOLUTION: In a semiconductor device 1A, a through electrode 5 that connects an active surface 3 side where a circuit 2a of a semiconductor chip 2 is formed to the rear side of the active surface 3, is so formed as to penetrate the semiconductor chip 2. A first re-wiring pattern 8A that connects a terminal 2b of the circuit 2a to the through electrode 5 is formed on the active surface 3 side of the semiconductor chip 2. A first external connection terminal 4A is formed in the first re-wiring pattern 8A and an external connection terminal is formed on the active surface 3 side of the semiconductor chip 2. Further, a second re-wiring pattern 10 that is connected to the through electrode 5 is formed on the rear surface side of the active surface 3 of the semiconductor chip 2. A second external connection terminal 6A is formed in the second re-wiring pattern 10. An external connection terminal is formed on the rear surface side of the active surface side 3 of the semiconductor chip 2 as well. COPYRIGHT: (C)2008,JPO&INPIT
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