| 摘要 |
End portions (210a/b, 310a/b, 410a/b) of an antenna wire (210, 310, 410) mounted to an inlay substrate are left un-mounted, and are pre-positioned adjacent (rather than within or above) a site (designated area) on the substrate for receiving a transponder chip (208, 308, 408). After the transponder chip is installed on the substrate, the end portions of the antenna wire are re- posit ioned (FIG. 2B, FIG. 3C) to be over corresponding terminals (208a/b, 308a/b, 408a/b) of the transponder chip, for subsequent connection (bonding) thereto. Insulation from the wire may be removed (FIG. 6A) prior to bonding. |
