| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device which can be properly adapted independently in processing a tape-mount device as well as a direct-placement processing device. SOLUTION: The cutting device includes a first table 221 for tape-mount processing having suction portions 221a made of a porous material and a metal second suction table for direct-placement processing having suction holes communicating with a second negative pressure source that are formed only in a suction region corresponding to the shape of a workpiece in such a way that the first and second tables can be replaced freely with each other in combination with a suction base 21. The cutting device also includes a first pipeline path 61 and a second pipeline path 62 that are disposed in correspondence to the first suction table 221 and the second suction table in such a way that the first pipeline path and the second pipeline path allow a suction mechanism 20 to selectively communicate with an ejector 51a and a water sealing vacuum pump 52a. A control means 70 exclusively carries out switchover between the first and second pipeline paths 61 and 62 depending on the type of the suction table to be used. COPYRIGHT: (C)2008,JPO&INPIT |
